Intel Celeron LGA 775 Processor

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please help me in collecting some information regarding Intel Celeron LGA 775 Processor?
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The Intel Celeron D processor delivers a balanced level of proven technology and exceptional value for desktop PCs.

There have been changes have made the LGA775 Intel Pentium 4 processor a little more durable, while allowing connector density to increase without radically enlarging the package size. Conversely, the new socket 775 is now extremely fragile, and instead of dealing with damaged CPU pins, careless users could be left with damaged sockets and useless motherboards as a consequence. In theory, the new socket themselves are also much more vulnerable to wear and tear with repeated installations... None of this should really affect the average consumer, but it may certainly impact enthusiasts who swap out CPUs all day in search of better and bigger speeds. Whichever category you fall into, LGA775 Pentium 4 processor installation is now a tense operation.

The Pentium 4 3.2E LGA775 (Land Grid Array) Socket 775 processor is based on the same 0.09 micron manufacturing process as its Socket 478 Prescott cousin. Actually, the CPU is based on the same 'Prescott' core as is found within Socket 478 CPUs; and includes the 31-stage pipeline which is 50% longer than that found in the 'Northwood' core Pentium 4 processors, with a 16KB L1 cache and a large 1MB L2 cache.

The Socket 775 Pentium 4 3.2E still incorporates the integrated heat spreader (IHS) to help protect the underlying silicon core from physical damage. It is made from nickel-plated copper and presents a larger surface area for heatsinks to work with. As you may notice from the marketings on the IHS, the 3.2E processor PCSTATS is testing is based on the D0 stepping (S-Spec SL7J7) and was produced in the end of March or early April of 2004.

Note that while the bottom of the Pentium 4 540 processor is pinless, it is not entirely flat. At the center of the processor package are resistors and capacitors; both these electrical components and the small gold contacts are fragile, and the documentation recommends against touching them with your fingers.Now that the socket has all the pins, it's vital that LGA775 Pentium 4 processors are installed correctly, and in the right orientation. That's why Socket 775 processors have two keys on opposite sides off-center.

All Intel LGA775 processors use the FC-LGA4 package, which means that the processor die is on top of the substrate on the opposite side from the LAND contacts. This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heat sink. Intel actually solders the IHS to the core of the processor, so the contact on the processor is usually not of concern. This brings us to the situation on hand. Many of the Allendale and Conroe processors that we have lapped have had heat spreaders that were not flat.

The local automotive supply store and picked up a number of different sandpaper packs ranging from 400 grit to 2500 grit. Using 2000 grit to 2500 grit sandpaper is far better than the factory finish, but for those that want to go crazy can invest in 1 micron diamond lapping compound to rub out all the sanding marks for a true mirror finish.

All Intel LGA775 processors feature copper integrated heat spreaders, so getting one of the flat will allow for great thermal transfer between the IHS and our copper water block. Once the block was flat and all the nickel was gone we moved on to finer sandpaper grits and called the surface of the IHS done after we used some 2500 grit paper on it.

Intel’s new LGA, or Land Grid Array, 775 processor socket takes a step away from traditional implementations in that the package no longer features pins, rather the bottom of the LGA 775 processors only have small gold contacts. With the LGA package, Intel has moved the pins into the bottom portion of the processor socket, something that will make installation of the processor easier in that there is no need to watch for bent pins on the package...although it will make it more difficult as well. You no longer need to worry about bent or damaged pins on the processor, rather now you have to worry twice as much about bent pins within the processor socket itself. We’ve heard some horror stories about the frailty of these pins, and from working first hand with LGA 775 motherboards, In order to properly install the processor, you need to vertically drop it in the socket.

LGA 775 isn’t all bad, in fact it comes along with quite a few positive aspects. The processor can now deal with a higher amount of current flowing into it due to and increased number of power pins. This helps take the incredible current load off of many of the other power pins, and can help lower the amount of leakage, and also reduce some heat. Heat has been the primary issue with Intel’s latest processors, especially Prescott. Herein lies yet another positive aspect of LGA 775. With the plastic retention mechanisms used on 478 platforms, as heatsinks began to grow in mass due to increased thermal requirements, the motherboards would begin to bow due to the mechanical stress placed upon them. The heaviest heatsinks where mounted through the motherboard, as this helped relieve and disperse some of the stress. With the LGA 775 socket, Intel has allowed for similar implementations to be used as a standard. Many found the 478 heatsinks to offer incredibly easy installation, and with this new socket, Intel has made this task even easier.

Lastly, I know I’m not the only one out there who has went to remove their heavy copper heatsink and had the processor end up pulling right out of the socket with it. This has surely lead to some scary moments for consumers out there as well. With the new socket, Intel has fixed this problem. When the socket is unlocked, there is a small casing with a square portion removed from it that rotates upward. Once the processor is installed, and the socket locked down, this outer casing holds down the processor by the outer edges removing all possibility of damage due to a heatsink swap.