IC Diamond 7 Carat

hi there ........
i have heard about ICD or you can say IC Diamond 7 Carat; but exactly consists of no knowledge about it.......similarly how it is as compared to other's in the same field.........
please provide some views on it.........

Read this:

IC Diamond was originally designed as a high reliabilty T1 compound for use between the IHS and CPU. IC Diamond is highly bulk loaded with over 92% micronized diamond particles to limit pump out due to thermal cycling.
IC Diamond has undergone considerable user testing combined with Innovation Cooling's own studies to optimize performance along with ease of application. It is highly recommended that you use our procedure and no others for best results.

IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity. Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.

Key Features:

• Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 94% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
  
• Superior bulk conductivity
  
• Excellent thermal impedance
  
• Tight particle distributions
• Less than 40 µ maximum particle diameter
  
• Silicone free
  
• Lower viscosity
  
• Greater stability
  
• Non capacitive or electrically conductive

Key Specifications:

• Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470
  
• thermal interface test instrument)
  
• Thermal Resistance: 0.25oC-cm2/W at 100 µ BLT
  
• Average Particle Size: Less than 40 µ maximum particle diameter
  
• Compliancy: RoHS Compliant.

Try this one:

The new IC Diamond 7 Carat Thermal Compound (IC7) is generally compared with AS5 for a long time. IC7 consistency, Features, Specification and implementation is compared to the rather oily AS5. The manufacturer’s manual provides an instruction applying a thin coat of IC7 , but it is more easy to say then to try and execute. For coating you have to peel off and then it will leave holes in the coat as you start applying it. It also suggests ld heat up the syringe before using it, but problem that occur during this is as soon as you coat it takes no time to cool down. So keep heating up the CPU/using a hot halogen lamp, and the IHS temp will be approximately around 45-50 C. Finally applying successful it states you that allow the coat to set for 10-15min before mounting the cooler on the coat, which is fine, but there is a possibility of increasing the risk of dust particles getting attracted towards the coat.

IC Diamond 7 Carat Thermal Compound

Each tube of ICD Thermal grease contains 7 carats of micronized diamond particle loadings at 92% by weight, 94%; but after 10 minute dries out prior to heat sink installation. Material loading above 90% is as the best combination of rheological and thermal properties for minimizing interface pump out due to thermal cycling. It also consists of Superior bulk conductivity. There is an excellent thermal impedance. Due to tight particle distributions, Less than 40 µ maximum particle diameter is observed which is Silicone free. It also consists of Lower viscosity and Greater stability. In general nature, it is non capacitive or electrically conductive.

Specifications:

• Size: 1.5 gram tube
  
• Thermal Conductivity: 4.5 W/m-K
  
• Thermal Resistance: 0.25°C-cm2/W@ 100 µ BLT
  
• Electrically Conductive: No

According to the Company facts and figures the high amount of diamond powder which is 94% in ICD Compound, the material turns to be very thick. The plunger on the syringe should not be forced at any cost which would then result into its breaking. Squeeze slowly using constant hault and slowly presurrise as you go squeezing and it will take about 3-4 seconds to squeeze out the proper amount. Try to make the Thermal compound syringe warm in a cup of hot water for several minutes which will now enhance application.
Clean the surface of CPU to ensure that it is clean of any grease or particular matter. Squeeze a small amount of IC Diamond in the center of the CPU and place the heatsink on it. Once the heatsink is mounted, the compound will spread out through out the surface of CPU and cover the entire CPU and settle into a uniform thickness in approximately 2 hours.

Dumb question but are you letting it settle for those two hours with it seperate from your MOBO or do you reinstall it to your MOBO and have it powered on for that two hours.

And does center placement really ensure even distribution of the compound with out physically spreading it evenly?

Thank you in advance for answering these probably obvious questions.