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I have a very serious troubleshooting. My G33 motherboard is now became fire hazard when turned on. I am confused to get LGA1156 and the Core i7-860. My last OC 3.32ghz on a Q6700 blew up the motherboard before the processor. I also want to save money. Also help me plan hardware for my system.
Your troubleshooting is very serious. Since I am not well versed with fire hazard criteria so, I can only help you with the specifications for your system. Below is the specification:
- Core 2 Duo SL9400 1.86Ghz
- Intel GS45 chipset - 4500MHD Graphics
- Corsair 2x2GB DDR3-1333 @ 1066 8-8-8-20
- Intel X25-V 40GB
- Wacom Penabled
- Windows 7 Pro 64bit
According to me you should try to choose right parts. The reason I am suggesting that because it won’t cause blowing problems in future also about anything falling. If you tend to agree with the Poci, I mean about the 3.6GHz should be easy. It won’t be strain in future to you. I think X58 boards are a bit more flexible. After that you can think of going to higher versions or products but not prior ones.
I have experienced with the ASUS P5K-VM with Pencil Mod. The review is that the 3.32Ghz Q6700 OC uses much or you can say consumes much electricity on the ATX12V CPU power connector. Also it results into melting it thus resulting fire hazard like yours. To solve that I settled up with my old HX520 PSU and it works fine. I am trying to say that only options we have is that change hardware i.e. choose proper hardware for our system so that there is no fire hazards in future.
Even I agree with the fact that you should have hardware changes to better, compatible and supportive configurations. The below configuration is a heat sink.
- I7-860
- Thermalright SI-128SE Heatsink
- PCP&C 750Watt Silencer
- EVGA P55 SLI
- ATI 5870
- 4GB (2x2GB) Corsair
- 80GB Intel X-25M Boot
- 64GB OZC Core Game drive
- 2x 1.5TB RAID1 Storage
- CL X-FI Extreme Gamer
- LG DVD RW
The below specification will not only help your system to heat sink but also will help you to improve your Overclocking. The configurations are as follows:
- Mem 2:8 7-7-7-20 1T/1067Mhz
- CPU A20M & Cstate disabled
- Dummy OC Disabled
- CPU Multiplier 21
- CPU Frequency 172
- PCIE 104
- QPI auto
- MCH auto
- Extreme cooling disabled
- Evga vdroop disabled
- Boot vcore 1.1875
- Eventual vcore 1.1875
- vdimm voltage 1.65
- boot vtt 1.2v
- eventual vtt 1.2v
My settings with running 3.6 Ghz and its running fine without troubleshoot. These are the settings that are similar to your BIOS after doing research as per your Mobo and chipset.
- Hardware prefetch enabled
- adj cache enabled
- MPS & ACPI modern
- MAX CPU enabled
- Intel Virtualization enabled
- EX Disable enabled
- Intel HT enabled
- Active cores all
- Speedstep enabled
- turbo disabled
- c-state disabled.
While both the I7 965 and i7 920 are engineering samples, the I7 920 was shipped with a retail heatsink. The size increase of the processor die necessitated a larger cooling solution as well. The same concept is used to cool the Nehalem chips that was used on the socket 775 processors, just larger. The copper center slug is surrounded by an aluminum fin matrix to shed the heat generated by the processor. Big is good when it comes to cooling!