In a conventional CPU cooler, the bottleneck is the heat transfer boundary layer of "dead air" that adheres to the cooling fins. This insulating layer is largely unaffected by the incident air flow generated by the fan. The drastically dissimilar approach described here overcomes this thermal bottleneck, ensuing in enhanced a number of times in the cooling performance on a device that is smaller, quieter, and immune to clogging by dust. This is what the information I got from the internet. I would be happy if you provide more information.